MEMS microphone packaging structure
AssigneeMerry Electronics Co., Ltd.
InventorJen-Yi Chen
Life of this patent
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Abstract
The invention provides a MEMS microphone packaging structure for reducing the packaging structure volume, lowering manufacturing cost and improving impact resistance. The packaging structure has a large back cavity formed by a recess of a controlling chip and a deep hole of a MEMS microphone chip. The controlling chip is disposed on the MEMS microphone chip for protecting the MEMS microphone chip. A plastic molding process can be applied on the packaging structure. A plurality of pads on a base of the packaging structure are protected by sealant or primer for protection against corrosion under atmospheric condition. In conclusion, the invention has advantages of small volume and thinner thickness without downgrading the performance, and the manufacturing cost can be lowered.
Claims12
A MEMS microphone packaging structure, comprising:
- a base having a surface and a through hole;
- a MEMS microphone chip having a plurality of metal bumps, a first surface and a second surface, the MEMS microphone chip being electrically connected to the base by means of contacting the surface of the base through the metal bumps, and a deep hole being formed on the second surface of the MEMS microphone chip and extending to the first surface of the MEMS microphone chip;
- a controlling chip having a first surface and a second surface, the first surface of the controlling chip being fixed to and covering the deep hole of the MEMS microphone chip;
- a plurality of conductive wires electrically connected the second surface of the controlling chip with the base;
- and
- a sealing material covering the base, the MEMS microphone chip, the controlling chip, the conductive wires and the metal bumps arranged between the MEMS microphone chip and the base, wherein the sealing material has a first outer lateral wall, the base has a second outer lateral wall, and the first outer lateral wall trims the second outer lateral wall.
A MEMS microphone packaging structure, comprising:
- a base having a surface and a through hole;
- a MEMS microphone chip having a diaphragm, a first surface and a second surface, the first surface of the MEMS microphone chip being electrically connected to the surface of the base, and a deep hole being formed on the second surface of the MEMS microphone chip and extending to the first surface of the MEMS microphone chip;
- and
- a controlling chip having a first surface and a second surface, the first surface of the controlling chip being fixed to and covering the deep hole of the MEMS microphone chip, a recess being inwardly formed on the first surface of the controlling chip;
- wherein the recess of the controlling chip and the deep hole of the MEMS microphone chip communicating with each other to cooperatively define a back cavity, the back cavity is arranged over the through hole of the base, and the diaphragm is disposed between the back cavity and the through hole of the base.
Dependencies are inferred from the claim text.