Image capturing module for increasing assembly flatness and method of assembling the same

An image capturing module for increasing assembly flatness, comprising:

• an image sensing unit including a carrier substrate and an image sensing chip disposed on the carrier substrate and electrically connected to the carrier substrate, wherein the image sensing chip has a first horizontal top surface on the top side thereof;
• a housing frame disposed on the carrier substrate to surround the image sensing chip;
• an actuator structure disposed on the housing frame and above the image sensing chip, wherein the actuator structure includes a lens holder disposed on the housing frame and a movable lens assembly movably disposed inside the lens holder and above the image sensing chip, and the movable lens assembly has a first plane on the top side thereof;
• and
• a reflecting material movably and temporarily placed on the first plane of the movable lens assembly, wherein the reflecting material has a second horizontal top surface on the top side thereof, the reflecting material has a second plane on the bottom side thereof and corresponding to the first plane, and the second plane is horizontal to the second horizontal top surface;
• wherein the first horizontal top surface of the image sensing chip and the second horizontal top surface of the reflecting material are horizontal to each other, for increasing the assembly flatness of the movable lens assembly relative to the image sensing chip.

A method of assembling an image capturing module for increasing assembly flatness, comprising:

• providing an image sensing unit and a housing frame, wherein the image sensing unit includes a carrier substrate and an image sensing chip disposed on the carrier substrate and electrically connected to the carrier substrate, and the housing frame is disposed on the carrier substrate to surround the image sensing chip;
• obtaining a first horizontal top surface on the top side of the image sensing chip by a horizontal correction system using a laser light source;
• providing an actuator structure disposed on the housing frame and above the image sensing chip, wherein the actuator structure includes a lens holder disposed on the housing frame and a movable lens assembly disposed inside the lens holder and above the image sensing chip, and the lens holder includes a surrounding movable member movably disposed therein;
• temporarily placing a reflecting material on the top side of the movable lens assembly;
• obtaining a second horizontal top surface on the top side of the reflecting material by the horizontal correction system using the laser light source, wherein the first horizontal top surface of the image sensing chip and the second horizontal top surface of the reflecting material are horizontal to each other, for increasing the assembly flatness of the movable lens assembly relative to the image sensing chip;
• fixing the movable lens assembly inside the surrounding movable member through at least two separate bonding glue, wherein the movable lens assembly is movably disposed inside the lens holder through the surrounding movable member;
• and
• removing the reflecting material from the movable lens assembly.