Three-dimensional power amplifier architecture
AssigneeNational Taiwan University
InventorsJin-Fu Yeh, Jeng-Han Tsai, Tian-Wei Huang
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AssigneeNational Taiwan University
InventorsJin-Fu Yeh, Jeng-Han Tsai, Tian-Wei Huang
Estimating the term…
The present disclosure provides a three-dimensional (3-D) transformer-based (TF-based) power amplifier architecture, including a power splitting plane having at least one input transformer-based circuit; and a power combining plane having at least one output transformer-based circuit. The power splitting plane includes at least one input transmission line, at least one input transformer and an input terminal. Moreover, the power combining plane includes at least one output transmission line, at least one output transformer, at least one power amplifier-cell (PA-cell) and an output terminal. The power combining plane is vertically stacked, attached and electrically connected to the power splitting plane. Consequently, as compared with the existing 2-D power amplifiers, the 3-D transformer-based power amplifier architecture of the present disclosure is capable of achieving a symmetric and compact power distribution layout. Accordingly, the present disclosure further provides an integrated circuit layout for the 3-D TF-based power amplifier architecture.
A three-dimensional (3-D) power amplifier architecture, comprising:
An integrated circuit (IC) layout for a three-dimensional (3-D) power amplifier architecture, comprising:
Dependencies are inferred from the claim text.