Method of making an electronic interconnect

A method of making an electrical interconnect comprising the steps of:

• arranging a plurality of layers into a substrate with at least two adjacent layers configured to translate relative to each other between a nominal position and a translated position;
• forming a plurality of through holes through the layers from a first surface of the substrate to a second surface of the substrate in both the nominal position and the translated position;
• positioning at least one contact member in the through holes with distal portions accessible from the first surface of the substrate and a proximal portions positioned near the second surface;
• securing the proximal portion of the contact members to the substrate near the second surface with a conductive structure;
• and
• translating the two adjacent layers of the substrate from the nominal position to the translated position to elastically deform the contact members within the through holes of the substrate and to displace the distal portions of the contact members toward the conductive structures, respectively.