Organic light-emitting display device
AssigneeSamsung Display Co., Ltd.
InventorsTae-Wook Kang, Young-Seo Choi, Jin-Ho Kwack
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Abstract
An organic light-emitting display device including a substrate on which a display region and a non-display region are defined is described, the organic light-emitting display device comprising: a first electrode disposed on a substrate; an intermediate layer disposed on the first electrode and including an organic light-emitting layer; a second electrode disposed on the intermediate layer; an encapsulation layer disposed on the substrate; a plurality of pad units disposed on the non-display region; a wiring unit disposed on the display region; and a bridge wiring that is disposed across the display region and the non-display region and connects one of the plurality of pad units and the wiring unit to each other.
Claims19
An organic light-emitting display device, comprising:
- a substrate on which a first region including a display region and a second region including a non-display region outside the first region are defined;
- a first electrode disposed on the substrate;
- an intermediate layer disposed on the first electrode and comprising an organic light-emitting layer;
- a second electrode disposed on the intermediate layer;
- an encapsulation layer disposed on the substrate;
- a pad unit disposed on the second region;
- a wiring unit disposed on the first region;
- and
- a bridge wiring that is disposed across the first region and the second region and connects the pad unit and the wiring unit to each other, the bridge wiring including a first wiring layer and a second wiring, layer on the first wiring layer.
An organic light-emitting display device, comprising:
- a substrate on which a first region including a display region and a second region including a non-display region outside the first region are defined:
- a first electrode disposed on the substrate;
- an intermediate layer disposed on the first electrode and comprising an organic light-emitting layer;
- a second electrode disposed on the intermediate layer;
- a first insulating layer formed on the substrate;
- a pad unit disposed on the second region, the pad unit being formed on the first insulating layer;
- a wiring unit disposed on the first region, the wiring unit being formed on the first insulating layer;
- a second insulating layer formed between the substrate and the first insulating layer;
- a bridge wiring that is disposed across the first region and the second region, the bridge wiring being formed on the second insulating layer, the wiring unit being connected to the bridge wiring through a first via hole in the first region, and the pad unit being connected to the bridge wiring through a second via hole in the second region;
- and
- an encapsulation layer disposed on the substrate, the encapsulation layer comprising a first portion comprising a first thin film and a second thin film that are alternately stacked on each other, the first portion being disposed on the substrate, the encapsulation layer further comprising a second portion comprising the first thin film,
- wherein a lowest thin film of the encapsulation layer has a first part corresponding to a central portion of the bridge wiring and a second part n the wiring unit and corresponding to the first via hole, the first part has a first surface facing the bridge wiring, the second part has a second surface facing, the wiring unit, and the first surface is closer to the substrate than the second surface.
Dependencies are inferred from the claim text.