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US 9,318,674 B2Granted
Submount-free light emitting diode (LED) components and methods of fabricating same
AssigneeCree, Inc.
InventorsChristopher P. Hussell, Peter S. Andrews, Jesse C. Reiherzer
Life of this patent
Estimating the term…
Abstract
Light emitting devices include a Light Emitting Diode (LED) chip having an anode contact and a cathode contact on a face thereof. A solder mask extends from the gap between the contacts onto one or both of the contacts. The LED chip may be mounted on a printed circuit board without an intervening submount. Related fabrication methods are also described.
Claims31
A light emitting device comprising:
- a Light Emitting Diode (LED) chip having first and second opposing faces;
- an anode contact and a cathode contact that are spaced apart from one another on the first face to define a gap therebetween, the anode and cathode contacts having outer faces that are remote from the first face;
- a layer that extends from the gap onto the outer face of the cathode contact, the layer having a first face adjacent the outer face of the cathode contact, and a second face remote from the outer face of the cathode contact;
- and
- a first solder layer on the outer face of the anode contact and a second solder layer on the outer face of the cathode contact that are spaced apart from one another by the layer that extends onto the outer face of the cathode contact, wherein the first and second solder layers extend closer to the first face of the LED chip than the second face of the layer,
- wherein the cathode contact is wider than the anode contact and wherein the layer extends from the gap onto the outer face of the cathode contact, but does not extend onto the outer face of the anode contact.
3 more elements
A light emitting device comprising:
- a Light Emitting Diode (LED) chip having first and second opposing faces;
- an anode contact and a cathode contact that are spaced apart from one another on the first face to define a gap therebetween, the anode and cathode contacts having outer faces that are remote from the first face;
- a layer that extends from the gap onto the outer face of the anode contact and/or the outer face of the cathode contact, the layer having a first face adjacent the outer face of the anode contact and/or the outer face of the cathode contact, and a second face remote from the outer face of the anode contact and/or the outer face of the cathode contact;
- and
- a receiving surface directly on the outer faces of the anode and cathode contacts and directly on the layer.
2 more elements
A light emitting device comprising:
- a Light Emitting Diode (LED) chip having first and second opposing faces;
- an anode contact and a cathode contact that are spaced apart from one another on the first face to define a gap therebetween, the anode and cathode contacts having outer faces that are remote from the first face;
- a layer that extends from the gap onto the outer face of the anode contact and/or the outer face of the cathode contact, the layer having a first face adjacent the outer face of the anode contact and/or the outer face of the cathode contact, and a second face remote from the outer face of the anode contact and/or the outer face of the cathode contact;
- and
- a first solder layer on the outer face of the anode contact and a second solder layer on the outer face of the cathode contact that are spaced apart from one another by the layer that extends onto the outer face of the anode contact and/or the cathode contact, wherein the first and second solder layers extend closer to the first face of the LED chip than the second face of the layer,
- wherein the layer comprises reflecting material.
3 more elements
A method of fabricating a light emitting device comprising:
- providing a Light Emitting Diode (LED) chip having first and second opposing faces and an anode contact and a cathode contact that are spaced apart from one another on the first face to define a gap therebetween, the anode and cathode contacts having outer faces that are remote from the first face;
- forming a layer that extends from the gap onto the outer face of the anode contact and/or the outer face of the cathode contact, the layer having a first face adjacent the outer face of the anode contact and/or the outer face of the cathode contact, and a second face remote from the outer face of the anode contact and/or the outer face of the cathode contact;
- and
- placing the LED chip on a receiving surface such that the outer faces of the anode contact, the cathode contact and the layer are directly on the receiving surface.
1 more element
Dependencies are inferred from the claim text.