High efficiency light emitting diode package suitable for wafer level packaging

A method for packaging a light emitting diode (LED) device, comprising:

• forming an encapsulant lens layer on a carrier substrate wafer having a plurality of LED devices disposed thereon, the encapsulant lens layer including a plurality of portions, each portion disposed over one of the plurality of LED devices and each portion of the encapsulant lens layer having a top surface inclined inwardly toward the top surface of the LED device and having a thickness at an interior portion of at least ten percent of a thickness at a peripheral portion relative to the top surface of the LED device;
• and
• dicing the carrier substrate wafer into a plurality of LED packages such that each LED package includes an LED device with a footprint area of at least fifty percent of a surface area of a carrier substrate, and a side wall having a set back distance from a side wall of the carrier substrate, the set back distance being between one quarter of one percent and fifteen percent of a width of the carrier substrate.