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US 9,318,667 B2Granted
Method for producing a light-emitting diode and light-emitting diode
AssigneeOSRAM Opto Semiconductors GmbH
InventorsIon Stoll, Hans-Christoph Gallmeier, Kirstin Petersen
Life of this patent
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Abstract
A method of producing a light-emitting diode includes providing at least one light-emitting diode chip, providing a suspension comprising a solvent and particles of at least one luminescent material, arranging the at least one light-emitting diode chip in the suspension, electrophoretically depositing the particles on an outer face of the at least one light-emitting diode chip, and completing the light-emitting diode.
Claims11
A method of producing a light-emitting diode comprising:
- providing at least one light-emitting diode chip,
- applying an electrically conductive protective material to parts of an outer face of each light-emitting diode chip,
- providing a suspension comprising a solvent and particles of at least one luminescent material,
- arranging the at least one light-emitting diode chip in the suspension,
- electrophoretically depositing the particles on an outer face of the at least one light-emitting diode chip,
- fixing the particles on the outer face after depositing the particles,
- removing the particles in places from the outer face after fixing the particles,
- removing the electrically conductive protective material after the electrophoretic deposition, and
- completing the light-emitting diode.
6 more elements
A method of producing a light-emitting diode comprising:
- providing at least one light-emitting diode chip, wherein each light emitting diode chip is arranged in a package,
- applying an electrically conductive protective material to parts of an outer face of the package,
- providing a suspension comprising a solvent and particles of at least one luminescent material,
- arranging the at least one light-emitting diode chip in the suspension,
- electrophoretically depositing the particles on an outer face of the at least one light-emitting diode chip,
- fixing the particles on the outer face after depositing the particles,
- removing the particles in places from the outer face after fixing the particles,
- removing the conductive protective material after the electrophoretic deposition, and
- completing the light-emitting diode.
6 more elements
Dependencies are inferred from the claim text.