Light emitting diode device and method for manufacturing same

A method for manufacturing a plurality of light emitting diode (LED) devices, the method comprising:

• providing a metal board, a plurality of insulated portions being formed in the metal board to divide the metal board into a plurality of isolated electrode preforms, every two adjacent electrode preforms being electrically connected to a corresponding LED chip therebetween;
• pressing the metal board to form a plurality of concave portions and a plurality of convex portions in the metal board, each convex portion surrounding two sides of a corresponding concave portion, each concave portion having a corresponding LED chip received therein;
• forming a substrate integrally with the metal board including in the convex portions;
• forming an encapsulant in each of the concave portions, the encapsulant covering the LED chips;
• and
• cutting the substrate into a plurality of individual LED devices;
• wherein pressing the metal board to form a plurality of concave portions and a plurality of convex portions in the metal board comprises:
• providing a mold comprising a top mold body and a bottom mold body, the top mold body forming a plurality of protrusions, the bottom mold body forming a plurality of recesses corresponding to the protrusions;
• and
• wherein the bottom surface of the top mold body further defines a plurality of cavities each corresponding to a respective one of the LED chips, and a height of each of the plurality of cavities is larger than that of the corresponding LED chip.