LED device manufacturing method and fluorescent material-dispersed solution used in same

A method for manufacturing an LED device having an LED chip and a wavelength conversion part to convert light emitted from the LED chip to light having a wavelength different from a wavelength of the light emitted from the LED chip, the method comprising:

• applying on a light transmissive substrate a phosphor dispersion liquid containing a solvent, a phosphor, a clay mineral and porous inorganic particles, the phosphor, the clay mineral and the porous inorganic particles being dispersed in the solvent, followed by drying to form a phosphor layer;
• applying on the phosphor layer a precursor solution in which a light transmissive ceramic precursor is dispersed in a solvent, followed by calcination to form a wavelength conversion part made of a light transmissive ceramic layer in which the phosphor, the clay mineral and the porous inorganic particles are dispersed;
• and
• installing the light transmissive substrate on which the wavelength conversion part is formed in an LED chip package including a package and an LED chip having an emission surface and disposed on the package.