Method and apparatus for image sensor packaging
AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorsTzu-Hsuan Hsu, Dun-Nian Yaung
Life of this patent
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Abstract
A device having a sensor die with a sensor and a control circuit die with at least one control circuit disposed therein, the control circuit die on the sensor die. A plurality of mounting pads is disposed on a second side of the sensor die. A first electrical connection connects a first one of the plurality of mounting pads to a first control circuit of the at least one sensor control circuit and a second electrical connection connects the first control circuit to the sensor. A third electrical connection connects the sensor to a second control circuit of the at least one control circuit and a fourth electrical connection connects the second control circuit to second one of the plurality of mounting pads.
Claims20
A device comprising:
- a sensor die having a sensor disposed therein;
- a control circuit die having at least one control circuit disposed therein, the control circuit die mounted on a first side of the sensor die;
- a plurality of mounting pads disposed on a second side of the sensor die;
- a first electrical connection connecting a first one of the plurality of mounting pads to a first control circuit of the at least one control circuit;
- a second electrical connection connecting the first control circuit to the sensor;
- a third electrical connection connecting the sensor to a second control circuit of the at least one control circuit;
- and
- a fourth electrical connection connecting the second control circuit to second one of the plurality of mounting pads.
A method of forming a device comprising:
- providing a sensor die having a sensor disposed therein, the sensor configured to sense light through a first surface of the sensor die;
- forming first metal elements in the sensor die, the first metal elements having first bond pads disposed at a second surface of the sensor die, and the first metal elements electrically connecting the first bond pads to the sensor;
- forming second metal elements and third metal elements in a control circuit die having at least one control circuit disposed therein, the second metal elements having first control circuit bond pads disposed at a surface of the control circuit die, the second metal elements electrically connecting the first control circuit bond pads to the at least one control circuit, and the third metal elements electrically connected to the at least one control circuit;
- and
- bonding the surface of the control circuit die to the sensor die, the first bond pads in contact with the first control circuit bond pads.
A device comprising:
- a sensor die having a sensor disposed therein and having a first bond surface;
- a first metal element in the sensor die, the first metal element including a first bond pad at the first bond surface, the first metal element electrically connecting the first bond pad to the sensor;
- a control circuit die having a second bond surface bonded to the sensor die, the control circuit die having a control circuit disposed therein;
- a second metal element and a third metal element in the control circuit die, the second metal element having a first control circuit bond pad disposed at the second bond surface, the second metal element electrically connecting the first control circuit bond pad to the control circuit, and the third metal element also being electrically connected to the control circuit;
- and
- wherein the first bond pad is in physical and electrical contact with the first control circuit bond pad.
Dependencies are inferred from the claim text.