Semiconductor device
AssigneeKabushiki Kaisha Toshiba
InventorsTakuma Hara, Kazutoshi Nakamura, Tsuneo Ogura
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AssigneeKabushiki Kaisha Toshiba
InventorsTakuma Hara, Kazutoshi Nakamura, Tsuneo Ogura
Estimating the term…
In one embodiment, a semiconductor device includes a first semiconductor layer of a first conductivity type having first and second faces, and a second semiconductor layer of a second conductivity type disposed above the first face of the first semiconductor layer. The device further includes control electrodes facing the first and second semiconductor layers via insulating layers, and extending to a first direction parallel to the first face of the first semiconductor layer, and third semiconductor layers of the first conductivity type and fourth semiconductor layers of the second conductivity type alternately disposed along the first direction above the second semiconductor layer. The device further includes fifth semiconductor layers of the first conductivity type disposed below the second semiconductor layer or disposed at positions surrounded by the second semiconductor layer, the fifth semiconductor layers being arranged separately from one another along the first direction.
A semiconductor device comprising:
Dependencies are inferred from the claim text.