Buried hard mask for embedded semiconductor device patterning
AssigneeCypress Semiconductor Corporation
InventorsScott A. Bell, Angela Tai Hui, Simon S. Chan
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AssigneeCypress Semiconductor Corporation
InventorsScott A. Bell, Angela Tai Hui, Simon S. Chan
Estimating the term…
Methods and apparatus for manufacturing semiconductor devices, and such semiconductor devices, are described. According to various aspects of the disclosure, a semiconductor device can be manufactured by forming a core region of the semiconductor device and forming a periphery region of the semiconductor device. A first polysilicon region can then be formed over the core and periphery regions of the semiconductor device. A first mask is formed on the first poly silicon layer and a second polysilicon layer is disposed such that the second polysilicon layer covers the first mask. A second mask can then be formed on the second polysilicon layer. After forming the second mask, portions of the first and second polysilicon layers that are uncovered by either the first or second masks are removed.
A method of manufacturing an embedded semiconductor device, comprising:
An apparatus, comprising:
Dependencies are inferred from the claim text.