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US 9,318,473 B2Granted
Semiconductor device including a polymer disposed on a carrier
AssigneeInfineon Technologies AG
InventorsJoachim Mahler, Khalil Hosseini, Edward Fuergut, Manfred Mengel
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Abstract
In a method of manufacturing a semiconductor device, a first semiconductor element is mounted on a carrier. A b-stage curable polymer is deposited on the carrier. A second semiconductor element is affixed on the polymer.
Claims25
A semiconductor device comprising:
- a carrier;
- a first semiconductor chip mounted on a planar surface of the carrier;
- a cured and cross-linked polymer disposed on the planar surface of the carrier, wherein the polymer is in contact with a side surface of the first semiconductor chip;
- a second semiconductor chip affixed on the planar surface of the carrier by the polymer, wherein a surface of the second semiconductor chip facing the carrier is in contact with the polymer, wherein the planar surface of the carrier facing the second semiconductor chip is in contact with the polymer, and wherein an outline of the second semiconductor chip is located completely outside of an outline of the first semiconductor chip when viewed in a direction perpendicular to the planar surface of the carrier;
- and
- an encapsulation body encapsulating the first semiconductor chip and the second semiconductor chip, wherein the carrier electrically couples the first semiconductor chip to a contact element comprising a planar surface exposed from the encapsulation body, and wherein the exposed planar surface of the contact element is perpendicular to the planar surface of the carrier.
3 more elements
A semiconductor device comprising:
- a carrier;
- a conductive metal layer disposed on the carrier;
- a first semiconductor element disposed on a planar surface of the conductive metal layer;
- a cured and cross-linked polymer layer directly disposed on the planar surface of the conductive metal layer;
- a second semiconductor element directly disposed on the polymer layer, wherein an outline of the second semiconductor element is located completely outside of an outline of the first semiconductor element when viewed in a direction perpendicular to the planar surface of the conductive metal layer;
- and
- an encapsulation body encapsulating the first and second semiconductor elements,
- wherein the first semiconductor element is electrically connected to the conductive metal layer, wherein the polymer layer is in contact with sidewalls of the first semiconductor element,
- wherein the conductive metal layer electrically couples the first semiconductor element to a contact element comprising a planar surface exposed from the encapsulation body, and
- wherein the exposed planar surface of the contact element is perpendicular to the planar surface of the conductive metal layer.
7 more elements
Dependencies are inferred from the claim text.