US 9,318,469 B2 · Stack package and system-in-package including the same

Abstract

A system-in-package includes first and second semiconductor chips disposed in a first region over a substrate, and a controller disposed in a second region over the substrate and selectively supplying a power supply voltage to the first or second semiconductor chip based on a data output operation of the first and second semiconductor chips, wherein each of the first and second semiconductor chips includes a first power supply region coupled with the controller through a first line and receiving the power supply voltage from the controller in common during an input/output operation of the first and second semiconductor chips, an output driver suitable for outputting data, and a second power supply region independently coupled with the controller through one of a second line and a third line and independently receiving the power supply voltage for an operation of the output driver from the controller during the data output operation.

Claims22

Dependent claims

A system-in-package, comprising:

first and second semiconductor chips disposed in a first region over a substrate;
and
a controller disposed in a second region over the substrate and suitable for selectively supplying a power supply voltage to the first or second semiconductor chip based on a data output operation of the first and second semiconductor chips,
wherein each of the first and second semiconductor chips includes:
a first power supply region coupled with the controller through a first line and receiving the power supply voltage from the controller in common during an input/output operation of the first and second semiconductor chips;
an output driver suitable for outputting data;
and
a second power supply region independently coupled with the controller through one of a second line and a third line and independently receiving the power supply voltage for an operation of the output driver from the controller during the data output operation of the first or second semiconductor chips.

5 more elements

A stack package, comprising:

first and second semiconductor chips stacked over a substrate,
wherein the first semiconductor chip includes:
a first chip enable pad suitable for receiving a first chip enable signal;
a first input/output pad suitable for receiving and outputting data;
a first output driver suitable for outputting the data;
and
a first output pad suitable for supplying a power supply voltage to the first output driver, and
the second semiconductor chip includes:
a second chip enable pad suitable for receiving a second chip enable signal;
a second input/output pad suitable for receiving and outputting the data;
a second output driver suitable for outputting the data;
and
a second output pad suitable for supplying the power supply voltage to the second output driver,
wherein the first and second chip enable pads are separately coupled with an external device through a first line and a second line, respectively, and the first and second input/output pads are coupled with each other through a third line, and the first and second output pads are separately coupled with the external device through a fourth line and a fifth line, respectively.

11 more elements

Dependencies are inferred from the claim text.

Stack package and system-in-package including the same

Life of this patent

Stack package and system-in-package including the same

Life of this patent

Abstract

Claims22