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US 9,318,466 B2Granted
Method for electronic circuit assembly on a paper substrate
AssigneeGlobalfoundries Inc.
InventorsSaket Chadda, Ramakanth Alapati, Adam Beece
Life of this patent
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Abstract
A methodology for a thin, flexible substrate having integrated passive circuit elements, and the resulting device are disclosed. Embodiments may include integrating one or more passive circuit components on a first or second surface of a substrate, and interconnecting one or more integrated circuit (IC) dies on a second surface of the interposer to the one or more passive circuit components with one or more metal-filled vias between the first and second surfaces, the first and second surfaces being opposite surfaces of the substrate.
Claims10
A method comprising:
- integrating one or more passive circuit components on a first surface of a substrate;
- and
- interconnecting one or more integrated circuit (IC) dies on a second surface of the substrate to the one or more passive circuit components with one or more metal-filled vias between the first and second surfaces,
- wherein the first and second surfaces are opposite surfaces of the substrate, and
- wherein the substrate is formed from a carbon-based material different from silicon (Si) and FR4 and which has a coefficient of thermal expansion (CTE) matched to that of Si, and by depositing alumina or a multilayer dielectric that has low permeability to oxygen and moisture on a paper substrate, by atomic layer deposition (ALD).
2 more elements
A method comprising:
- forming one or more openings in a substrate by mechanical punching, laser drilling, or chemical etching;
- forming a conformal dielectric layer on all exposed surfaces of the substrate;
- filling the one or more openings with solder, tungsten (W), copper (Cu), titanium (Ti), silver (Ag) or other metal-based paste, to form one or more metal filled vias;
- forming a patterned metal layer on the conformal dielectric layer on one side of the substrate;
- forming an insulating layer on the one side of the substrate over the patterned metal layer;
- integrating one or more passive circuit components in the insulating layer on the patterned metal layer;
- forming one or more solder balls on another side of the substrate at the one or more metal-filled vias;
- and
- mounting one or more integrated circuit (IC) dies on the one or more solder balls,
- wherein the one side and the another side correspond to opposite surfaces of the substrate, and
- wherein the substrate is formed by depositing alumina or other dielectric that has low permeability to oxygen and moisture on a paper substrate by atomic layer deposition (ALD).
8 more elements
Dependencies are inferred from the claim text.