Methods for forming a semiconductor device package

A method of forming a semiconductor device package, the method comprising:

• forming a molding compound around a first connector, wherein the first connector is part of a first package including a die;
• removing a portion of the first connector to form an opening, wherein a sidewall of the opening is angled with respect to a top surface of the molding compound;
• placing a second connector in contact with the first connector, wherein the second connector is part of a second package;
• and
• bonding the second connector to a remaining portion of the first connector.

A method of forming a semiconductor device package, the method comprising:

• forming a molding compound around a first connector having a first height, wherein the first connector is part of a first package including a die, and the molding compound covers a top surface of the die;
• removing a portion of the first connector to form an opening in the molding compound, wherein the molding compound remains over the top surface of the die following the removing;
• placing a second connector in contact with the first connector, wherein the second connector is part of a second package;
• and
• bonding the second connector to a remaining portion of the first connector.