Side wettable plating for semiconductor chip package
AssigneeMaxim Integrated Products, Inc.
InventorKenneth J. Huening
Life of this patent
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Abstract
A method for providing a semiconductor chip package with side wettable plating includes singulating a semiconductor chip package from an array of packages formed in a block format, immersing the semiconductor chip package in a bath of plating solution, contacting a lead land of the semiconductor chip package with conductive contact material within the bath of plating solution, connecting the conductive contact material to a cathode electrical potential, connecting an anode within the bath of plating solution to an anode electrical potential, and plating the lead land of the semiconductor chip package.
Claims14
A system, comprising:
- a metalized backing;
- an adhesive disposed on the metalized backing;
- a plurality of conductive particles embedded in the adhesive, the plurality of conductive particles electrically connected to the metalized backing;
- and
- a semiconductor chip package in contact with the plurality of conductive particles embedded in the adhesive and electrically connected to the metalized backing, wherein the metalized backing and the semiconductor chip package are electrically connected to a ground.
A method comprising:
- contacting a semiconductor chip package with a conductive tape, the conductive tape including a metalized backing, an adhesive disposed on the metalized backing, and a plurality of conductive particles embedded in the adhesive, the plurality of conductive particles electrically connected to the metalized backing;
- and
- removing the conductive tape from the semiconductor chip package in its entirety.
Dependencies are inferred from the claim text.