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US 9,318,458 B2Granted
Bump structure having a side recess and semiconductor structure including the same
AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorsChih-Horng Chang, Tin-Hao Kuo, Chen-Shien Chen, Yen-Liang Lin
Life of this patent
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Abstract
A bump structure includes a first end; and a second end opposite the first end. The bump structure further includes a side connected between the first end and the second end, wherein the side comprises a recess for a reflowed solder material to fill, and the recess defines a first surface adjacent to the first end and a second surface adjacent to the second end.
Claims20
A bump structure comprising:
- a first end;
- a second end opposite the first end;
- a side connected between the first end and the second end, wherein the side comprises a recess, and the recess defines a first surface adjacent to the first end and a second surface adjacent to the second end;
- and
- wherein a depth of the recess into the bump structure ranges from about 0.5 μm to about 15 μm.
2 more elements
A semiconductor structure comprising:
- a plurality of bump structures configured to electrically connect to a separate die, wherein each bump structure of the plurality of bump structures comprises:
- a first end;
- a second end opposite the first end;
- and
- a side connected between the first end and the second end, wherein the side comprises a recess,
- wherein a recess for a first bump structure of the plurality of bump structures is oriented in a first direction, and a recess for a second bump structure of the plurality of bump structures is oriented in a second direction different from the first direction.
3 more elements
A semiconductor structure comprising:
- a plurality of bump structures configured to electrically connect to a separate die, wherein each bump structure of the plurality of bump structures comprises:
- a first end;
- a second end opposite the first end;
- and
- a side connected between the first end and the second end, wherein the side comprises a recess,
- wherein a first end for a first bump structure of the plurality of bump structures is oriented a first direction, and a first end for a second bump structure of the plurality of bump structures is oriented a second direction different from the first direction.
3 more elements
Dependencies are inferred from the claim text.