Methods of fabricating semiconductor chip solder structures
AssigneesATI Technologies ULC, Advanced Micro Devices, Inc.
InventorsRoden R. Topacio, Neil McLellan
Life of this patent
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Abstract
Various semiconductor chip solder bump and underbump metallization (UBM) structures and methods of making the same are disclosed. In one aspect, a method is provided that includes depositing a layer of a first metallic material on a semiconductor chip. The first layer has a first physical quantity. A layer of a second metallic material is deposited on the layer of the first metallic material. The second layer has a second physical quantity. The first and second layers are reflowed to form a solder structure with a desired ratio of the first metallic material to the second metallic material.
Claims20
An apparatus, comprising:
- a semiconductor chip including a layer of copper, the copper layer having a first preselected volume;
- and
- a layer of a metallic material on the copper layer, the layer of metallic material having a second preselected volume, the first and second metallic materials operable to convert into a solder bump upon reflow with a desired ratio of copper to the layer of metallic material, the desired ratio being based on the first preselected volume and the second preselected volume.
An apparatus, comprising:
- a semiconductor chip including solder bump;
- and
- whereby the solder bump being formed by depositing a layer of copper on the semiconductor chip, the copper layer having a first preselected volume, depositing a layer of a metallic material on the copper layer, the layer of metallic material having a second preselected volume, and reflowing the copper layer and the layer of metallic material to convert them into a solder bump with a desired ratio of copper to the layer of metallic material, the desired ratio being based on the first preselected volume and the second preselected volume.
An apparatus, comprising:
- a semiconductor chip including a layer of copper, the copper layer having a first preselected volume;
- and
- a layer of tin on the copper layer, the layer of tin having a second preselected volume, the copper layer and the tin layer being operable to convert into a solder bump upon reflow with a desired ratio of copper to tin, the desired ratio being based on the first preselected volume and the second preselected volume.
Dependencies are inferred from the claim text.