Semiconductor packages and methods of forming the same
AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorsHsien-Wei Chen, Jie Chen
Life of this patent
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Abstract
Embodiments of the present disclosure include semiconductor packages and methods of forming the same. An embodiment is a semiconductor package including a first package including one or more dies, and a redistribution layer coupled to the one or more dies at a first side of the first package with a first set of bonding joints. The redistribution layer including more than one metal layer disposed in more than one passivation layer, the first set of bonding joints being directly coupled to at least one of the one or more metal layers, and a first set of connectors coupled to a second side of the redistribution layer, the second side being opposite the first side.
Claims18
A semiconductor package comprising:
- a first package comprising one or more dies;
- and
- a redistribution layer coupled to the one or more dies at a first side of the first package with first bonding joints, the redistribution layer comprising more than one metal layers disposed in more than one passivation layers, each of the first bonding joints comprising a first conductive layer extending from the first side of the first package, a second conductive layer directly coupled to at least one of the more than one metal layers, and a joining material disposed between the first conductive layer and the second conductive layer, the joining material having a different material composition from each of the first conductive layer and the second conductive layer;
- and
- a first set of connectors coupled to a second side of the redistribution layer, the second side being opposite the first side.
A semiconductor package comprising:
- a die package comprising:
- a first die having a first side and a second side, the second side being opposite the first side;
- an encapsulant surrounding the first die and having a first side substantially level with the first side of the first die and a second side substantially level with the second side of the first die;
- and
- a through package via extending through the encapsulant from the first side to the second side of the encapsulant;
- and
- a redistribution layer bonded to the first side of the first die and the through package via with bonding joints, the redistribution layer comprising a plurality of metal layers disposed in a plurality of passivation layers, each of the bonding joints being directly coupled to a first metal layer of the plurality of metal layers, each of the bonding joints comprising solder, the bonding joints comprising a different material composition than the first metal layer.
A semiconductor package comprising:
- a first package comprising one or more dies;
- and
- a redistribution layer coupled to the one or more dies by a first set of bonding joints at a first surface of the first package, the redistribution layer comprising more than one metal layer disposed in more than one passivation layer, a first passivation layer of the more than one passivation layer of the redistribution layer being nearest to the first package, the first set of bonding joints being directly coupled to at least one of the one or more metal layers, the first set of bonding joints extending into openings of at least the first passivation layer, a first surface of the first passivation layer being nearest to the first package, a gap being between the first surface of the first package and the first surface of the first passivation layer;
- a first set of connectors coupled to a second side of the redistribution layer, the second side being opposite from the first surface of the first passivation layer;
- and
- a second package bonded to a second side of the first package by a second set of connectors, the second side being opposite the first surface of the first package, the second package comprising one or more dies.
Dependencies are inferred from the claim text.