Integrated fan-out package with dummy vias
AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorHsien-Wei Chen
Life of this patent
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Abstract
Disclosed herein is a device comprising a first redistribution layer (RDL) having first lands disposed on a bottom surface of the first RDL and active contact pads disposed on a top surface of the first RDL. The first RDL electrically connects the first lands to the active contact pads. A molding compound layer is disposed on the top surface of the first RDL. Active vias extend through the molding compound layer and are in electrical contact with the active contact pads. Dummy vias extending through the molding compound layer. Top surfaces of the active vias and top surfaces of the dummy vias are substantially planar with a top surface of the molding compound layer, and the dummy vias are electrically insulated from the active vias and the first lands.
Claims20
A device comprising:
- a first redistribution layer (RDL) having first lands disposed on a bottom surface of the first RDL and electrically coupled to active contact pads disposed on a top surface of the first RDL;
- a molding compound layer disposed on the top surface of the first RDL;
- active vias extending through the molding compound layer and in electrical contact with the active contact pads;
- dummy vias extending through the molding compound layer;
- and
- a second RDL disposed on a top surface of the molding compound layer;
- wherein top surfaces of the active vias and top surfaces of the dummy vias are substantially planar with a top surface of the molding compound layer;
- and
- wherein the dummy vias are electrically insulated from the active vias and the first lands.
A device comprising:
- a first redistribution layer (RDL) having first lands disposed on a bottom surface of the first RDL;
- a molding compound layer disposed on a top surface of the first RDL;
- dummy vias extending through the molding compound layer, wherein the dummy vias are electrically insulated from the first lands;
- a substrate disposed in the molding compound layer;
- and
- dummy studs extending from the top surface of the substrate to a top surface of the molding compound layer, wherein the dummy vias are electrically insulated from the first lands and from contact pads of the substrate;
- and
- wherein top surfaces of the dummy vias and top surfaces of the dummy studs are substantially planar with the top surface of the molding compound layer.
A device comprising:
- a die embedded in a first molding compound, the die having a die contact pad on a surface thereof;
- an active stud extending through the first molding compound and contacting the die contact pad and a dummy stud extending through the first molding compound and contacting a dielectric layer of the die;
- a second molding compound encapsulating the die and the first molding compound;
- a first interconnect structure on a first major surface of the second molding compound, the first interconnect structure having a first interconnect structure contact pad;
- an active via extending through the second molding compound and contacting the first interconnect structure contact pad and a dummy via extending through the second molding compound and contacting an insulating layer of the first interconnect structure;
- and
- a second interconnect structure on a second major surface of the second molding compound, opposite the first major surface, wherein the active via is in electrical contact with the second interconnect structure on the second major surface and the active stud is in electrical contact with the second interconnect structure at the second major surface and wherein the active via, the dummy via, the active stud and the dummy stud are substantially co-planar at the second major surface.
Dependencies are inferred from the claim text.