Power line structure for semiconductor apparatus
AssigneeSK hynix Inc.
InventorsJae Hwan Kim, Won John Choi
Life of this patent
Estimating the term…
Abstract
A semiconductor apparatus has one or more semiconductor chips. The semiconductor apparatus may include a power supply pad; power lines disposed on one side of the power supply pad, and including a first power line and a second power line; and connection lines connecting the power supply pad and the power lines. The connection lines may include a plurality of first connection lines connecting the power supply pad and the first power line, and a plurality of second connection lines connecting the power supply pad and the second power line, and disposed between the first connection lines. One or more pair of adjacent first connection lines may have a connection part by which the pair of adjacent first connection lines are connected with each other.
Claims9
A semiconductor apparatus including one or more semiconductor chips, comprising:
- a power supply pad;
- power lines disposed on one side of the power supply pad, and including a first power line and a second power line;
- and
- connection lines connecting the power supply pad and the power lines,
- the connection lines comprising:
- a plurality of first connection lines connecting the power supply pad and the first power line;
- and
- a plurality of second connection lines connecting the power supply pad and the second power line, and alternately disposed with the first connection lines,
- wherein one or more pair of adjacent first connection lines have a connection part by which the pair of adjacent first connection lines are connected with each other.
A semiconductor apparatus comprising:
- power supply pads including a first power supply pad which supplies first power and a second power supply pad which supplies second power;
- power lines disposed on one side of the power supply pads, and including a first power line which supplies the first power to a first internal circuit and a second power line which supplies the second power to the first internal circuit;
- and
- connection lines including a first connection line section which connects the power supply pads and the power lines to supply power to the first internal circuit, and a second connection line section which connects the power supply pads and the power lines to supply power to a second internal circuit,
- the first connection line section comprising:
- a first connection line module including one or more pair of first connection lines which connect the power supply pads and the first power line and are connected with each other at one ends thereof, and one or more second connection lines which connect the power supply pads and the second power line and is disposed in a space defined between the one or more pair of first connection lines;
- and
- a second connection line module including one or more pair of second connection lines which connect the power supply pads and the second power line and are connected with each other at one ends thereof, and one or more first connection lines which connect the power supply pads and the first power line and is disposed in a space defined between the one or more pair of second connection lines,
- the second connection line section comprising:
- a third connection line module connecting the first power supply pad and the first power line;
- and
- a fourth connection line module connecting the second power supply pad and the second power line,
- wherein the third connection line module is formed such that a width of a region which crosses with the first power line is larger than a width of a region which crosses with the second power line, and
- wherein the fourth connection line module is formed such that a width of a region which crosses with the second power line is larger than a width of a region which crosses with the first power line.
Dependencies are inferred from the claim text.