Integrated structure in wafer level package
AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorsYu-Hsiang Hu, Hung-Jui Kuo, Chung-Shi Liu
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Abstract
An embodiment device package includes a die having a conductive pillar and a molding compound extending along sidewalls of the die. The molding compound at least partially covers a top surface of the die. The device package further includes a conductive via extending through the molding compound and a redistribution layer (RDL) over the molding compound. The RDL and the molding compound have a continuous interface extending from the conductive via to a point over the die.
Claims20
A device package comprising:
- a die comprising a conductive pillar;
- a molding compound extending along sidewalls of the die, wherein the molding compound at least partially covers a top surface of the die;
- a conductive via extending through the molding compound;
- and
- a redistribution layer (RDL) over the molding compound, wherein the RDL and the molding compound comprise a continuous interface extending from the conductive via to the conductive pillar.
A device package comprising:
- a die comprising:
- a contact pad;
- a first polymer layer on a top surface of the die;
- and
- a conductive pillar extending through the first polymer layer and electrically connected to the contact pad;
- a molding compound extending along sidewalls of the die, wherein the molding compound covers a top surface of the first polymer layer;
- a conductive via extending through the molding compound;
- and
- one or more redistribution layers (RDLs), the one or more RDLs comprising:
- a second polymer layer over the molding compound, wherein the second polymer layer and the molding compound comprise a continuous interface extending from the conductive via to the conductive pillar;
- and
- a conductive feature electrically connected to the conductive pillar.
A method for forming a package structure comprising:
- providing a die comprising a conductive pillar;
- forming a passivation layer over the provided die, wherein the conductive pillar extends through the passivation layer;
- mounting the die to a carrier;
- forming a molding compound over the mounted die, wherein the molding compound covers a top surface of the passivation layer;
- forming a redistribution layer (RDL) over the molding compound, wherein the molding compound separates the RDL from the passivation layer, and wherein the RDL and the molding compound comprise a continuous interface extending from a point over the die past a sidewall of a die;
- and
- forming a connector over the RDL and electrically connected to the conductive pillar.
Dependencies are inferred from the claim text.