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US 9,318,428 B2Granted
Chip having two groups of chip contacts
AssigneeNXP B.V.
InventorHeimo Scheucher
Life of this patent
Estimating the term…
Abstract
A chip (1) has a substrate (2), an integrated circuit (3) provided on the substrate (2), a plurality of conductor zones (ME1, ME2, ME3, ME4, ME5) and a passivating layer (5) provided to protect the conductor zones and the integrated circuit, through-holes (6, 7) being provided in the passivating layer (5) through which chip contacts (8, 9) are accessible, wherein additional chip contacts (10, 11) and connecting conductors (12, 13) are provided on the passivating layer (5) and wherein each additional chip contact has an electrically conductive connection to a chip contact via a connecting conductor.
Claims20
A chip comprising:
- a substrate,
- an integrated circuit provided on the substrate,
- a passivating layer that protects the integrated circuit and which is provided with through-holes,
- a plurality of chip contacts formed by pads, which chip contacts are accessible from outside the chip through said through-holes and connected to the integrated circuit, wherein at least some of the pads are connected to a corresponding bump of a particular material extending through the passivating layer and configured and arranged to provide an external contact via an upper surface of the corresponding bump when the chip is connected to an external package or chip,
- additional chip contacts formed by additional bumps of, or including, the particular material resulting from a bumping process used to apply the corresponding bumps, the corresponding bumps and the additional bumps being exposed and respectively configured and arranged to couple the chip contacts to an external circuit, and
- for each additional chip contact, connecting conductors formed by elongated connecting bumps of, or including, the particular material on the passivating layer and electrically connecting the additional chip contact to one of the corresponding bumps, and wherein the height of one of the corresponding bumps is greater than the height of one of the elongated connecting bumps and the height of one of the additional bumps to which the one of the corresponding bumps is respectively connected, wherein the heights are defined as a distance of the particular material above a plane in which an upper surface of the passivating layer lies,
- the particular material over the passivating layer consisting of a single material having a height defined by a thickness of the particular material extending uninterrupted between a lower surface of the particular material in direct contact with the passivating layer, and an upper surface of the particular material.
4 more elements
A chip comprising:
- a substrate;
- an integrated circuit provided on the substrate;
- a passivating layer that protects the integrated circuit and which is provided with through-holes;
- a plurality of chip contacts formed by pads, which chip contacts are accessible from outside the chip through said through-holes and connected to the integrated circuit, wherein at least some of the pads are connected to a corresponding bump of a particular material;
- additional chip contacts formed by additional bumps of, or including, the particular material resulting from a bumping process used to apply the corresponding bumps, the corresponding bumps and the additional bumps being exposed and respectively configured and arranged to couple the chip contacts to an external circuit, the corresponding bumps being higher than the additional bumps and centrally located on the chip relative to the additional bumps;
- and
- for each additional chip contact, connecting conductors formed by elongated connecting bumps of the particular material on the passivating layer and electrically connecting the additional chip contact to one of the corresponding bumps, all of the particular material in the chip that is in physical contact with the particular material of the additional bumps being over the passivating layer and consisting of a single material having a thickness extending uninterrupted from a lower surface in direct contact with the passivating layer to an upper surface,
- wherein the height of one of the corresponding bumps is greater than the height of one of the elongated connecting bumps and the height of one of the additional bumps to which the one of the corresponding bumps is respectively connected, and wherein the heights are defined as a distance of the particular material above a plane in which an upper surface of the passivating layer lies.
5 more elements
Dependencies are inferred from the claim text.