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US 9,318,425 B2Granted
Semiconductor device
AssigneeFujitsu Limited
InventorsTeru Nakanishi, Nobuyuki Hayashi, Masaru Morita, Yasuhiro Yoneda
Life of this patent
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Abstract
A semiconductor device includes: a wiring board including a first electrode pad on a surface thereof; a circuit board disposed to stand on the wiring board, and including an interconnection connected to the first electrode pad; and a semiconductor package disposed to face the wiring board with the circuit board interposed therebetween, and including a second electrode pad on a surface thereof, the second electrode pad being connected to the interconnection.
Claims6
A semiconductor device comprising:
- a wiring board including a first electrode pad on a surface thereof;
- a plurality of circuit boards having slits that are fitted to each other, the circuit boards being disposed to stand on the wiring board, and including an interconnection connected to the first electrode pad with any one of a first solder and a first conductive adhesive;
- and
- a semiconductor component disposed to face the wiring board with the circuit boards interposed therebetween, and including a second electrode pad on a surface thereof, the second electrode pad being connected to the interconnection with any one of a second solder and a second conductive adhesive, wherein
- the circuit board comprises:
- a first resin film having the interconnection formed on one main surface thereof;
- and
- a second resin film formed on the interconnection and the first resin film,
- at least one of the first resin film and the second resin film has an opening formed on an end portion of the interconnection to expose the interconnection therefrom, and
- the end portion of the interconnection is connected to any one of the first electrode pad and the second electrode pad.
7 more elements
Dependencies are inferred from the claim text.