Flat no-lead package and the manufacturing method thereof

A flat no-lead package comprising:

• an encapsulating material, having a package bottom surface;
• a die pad, disposed in the encapsulating material and adjacent to the package bottom surface, wherein a plurality of die pad extensions extend from edges of the die pad, and a bottom surface of one end of each of the die pad extensions which is away from the die pad is exposed on the package bottom surface;
• a chip, disposed in the encapsulating material and mounted on the die pad;
• a plurality of first contact pads, disposed in the encapsulating material and near edges of the encapsulating material and being electrically coupled to the chip, wherein a bottom surface of the first contact pads is exposed on the package bottom surface;
• and
• a plurality of second contact pads, disposed in the encapsulating material and located between the die pad and the first contact pads and being electrically coupled to the chip, wherein each of the second contact pads has a second contact pad extension corresponding to one of the die pad extensions respectively, bottom surfaces of the second contact pads and the second contact pad extensions are exposed on the package bottom surface;
• wherein at least one of the first contact pads has a first contact pad extension extending to the die pad and bending away from the package bottom surface, where the at least one of the first contact pads is electrically coupled to the chip through the first contact pad extension.