Power semiconductor chip with a metallic moulded body for contacting thick wires or strips and method for the production thereof

A power semiconductor chip comprising:

• an upper bonding layer disposed on a potential face on an upper side of the power semiconductor chip,
• at least one upper metallic moulded body disposed on the upper bonding layer, a lower flat side of the at least one upper metallic moulded body facing the potential face and being coated to bond to the upper bonding layer, and
• thick wires or strips connected to an upper side of the at least one upper metallic moulded body,
• wherein a surface area of the upper bonding layer for bonding to the lower flat side of the at least one upper metallic moulded body in a plan view is smaller than the lower flat side of the at least one upper metallic moulded body such that a rim of the at least one upper metallic moulded body is fixed on an organic, non-conducting carrying foil.