Semiconductor device including conductive layer with conductive plug
AssigneeMicron Technology, Inc.
InventorTsutomu Aya
Life of this patent
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AssigneeMicron Technology, Inc.
InventorTsutomu Aya
Estimating the term…
Some embodiments include a semiconductor device which includes a first conductive layer formed on the semiconductor substrate and a first contact plug connected to the first conductive layer. The first conductive layer includes a plurality of loops of conductive material over the semiconductor substrate. Each of the plurality of loops comprises a first opening and a second opening, a first portion and a second portion sandwiching the first opening, a third portion and a fourth portion sandwiching the second opening, a first tab portion connected to the first portion and the third portion and having a first length in a first direction and a first width in a second direction perpendicular to the first direction, and a second tab portion connected to the second portion and the fourth portion and having a second length in the first direction and a second width in the second direction.
A semiconductor device comprising a first conductive line, the first conductive line comprising:
A semiconductor device comprising a first conductive line, the first conductive line comprising:
A semiconductor device comprising a first conductive line, the first conductive line comprising:
A semiconductor device comprising a first conductive line and a second conductive line,
A semiconductor device, comprising:
Dependencies are inferred from the claim text.