US 9,318,407 B2 · Pop package structure

Abstract

A package on package (PoP) package structure is disclosed, the structure includes at least two layers of carrier boards that are packaged and stacked in sequence, wherein chips are arranged on the bottom side of the carrier boards, a heat sink is arranged on the bottom side of a carrier board other than a layer-1 carrier board, a pad welded to a system board is arranged on the bottom side of the layer-1 carrier board, and a chip on a carrier board other than a top-layer carrier board is surface-mounted onto the heat sink adjacent to the chip. The heat sink increases the heat dissipation area of the chip, enhances the heat dissipation capabilities of the PoP stacked packages massively, breaks the bottleneck of the high-density integration and miniaturization of the PoP stacked packages, and enhances the packaging density of the PoP stacked packages.

Claims18

Dependent claims

A package on package (PoP) package structure, comprising:

a layer-1 carrier board comprising a pad arranged on a bottom side of the layer-1 carrier board that is configured to weld the PoP package structure to a system board;
a top-layer carrier board;
at least one other carrier board positioned between the layer-1 carrier board and the top-layer carrier board, wherein the layer-1 carrier board, the top-layer carrier board, and the at least one other carrier board are packaged and stacked in sequence;
a heat sink that is arranged on a bottom side of the top-layer carrier board and/or a bottom side of the at least one other carrier board, wherein the heat sink includes an extension part that extends out of the top-layer carrier board or the at least one other carrier board and that bends upward or downward;
and
a chip on the layer-1 carrier board and/or on the at least one other carrier board that is surface-mounted onto the heat sink adjacent to the chip.

3 more elements

Dependencies are inferred from the claim text.

Pop package structure

Life of this patent

Pop package structure

Life of this patent

Abstract

Claims18