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US 9,318,406 B2Granted
Device and method for determining the temperature of a heat sink
AssigneeSew-Eurodrive GmbH & Co. KG
InventorHarald Prautzsch
Life of this patent
Estimating the term…
Abstract
A method for determining the temperature of a heat source and an electronic unit, including a printed-circuit board equipped with a sensor and a heat sink, the sensor being connected to the heat sink in a heat-conducting manner.
Claims21
A device, comprising:
- a printed-circuit board;
- a sensor;
- and
- a heat sink;
- wherein the sensor is connected to the heat sink in a heat-conducting manner;
- wherein the printed-circuit board is directly connected to the heat sink at a metallic area at a surface of the printed-circuit board facing the heat sink at least one of (a) electrically and (b) in a heat-conducting manner;
- wherein the printed-circuit board is a multi-layer printed-circuit board;
- wherein metallic areas of inner layers of the printed-circuit board are electrically and thermally connected to at least one metallic area at the surface of the printed-circuit board facing the heat sink;
- and
- wherein the metallic areas are printed-circuit traces of the printed-circuit board.
7 more elements
A device, comprising:
- a printed-circuit board;
- a sensor having a connection to the printed-circuit board via connecting points;
- and
- a heat sink;
- wherein the sensor is connected to the heat sink in a heat-conducting manner;
- wherein the printed-circuit board is connected to the heat sink;
- wherein the printed-circuit board is a multi-layer printed-circuit board;
- wherein metallic areas of inner layers of the printed-circuit board are electrically and thermally connected to at least one metallic area at a surface of the printed-circuit board facing the heat sink;
- and
- wherein the printed-circuit board and the sensor are connected at least by a continuous material including an adhesive connection, the adhesive connection between the printed-circuit board and the sensor having a lower heat transfer resistance than the connection of the sensor to the printed-circuit board via the connecting points of the sensor.
7 more elements
A method for determining a temperature of a heat source connected to a heat sink in a heat-conducting manner, a sensor being connected to the heat sink in a heat-conducting manner, a multi-layer printed-circuit board being equipped with the sensor, comprising:
- determining a temperature of the sensor;
- determining a measure for a temperature rise within a period of time;
- determining a correction factor associated with the temperature rise, the correction factor being based on at least one of (a) a slope value of a curve of the temperature of the sensor plotted against time, and (b) an environmental temperature value;
- and
- determining the temperature of the heat source from a sum of the temperature of the sensor and the measure for the temperature rise multiplied by the correction factor associated with the temperature rise.
2 more elements
Dependencies are inferred from the claim text.