Semiconductor device and method of forming stress relieving vias for improved fan-out WLCSP package

A semiconductor device, comprising:

• a semiconductor die;
• an encapsulant disposed around the semiconductor die;
• a plurality of vias formed through a first surface of the encapsulant with a first portion of the encapsulant remaining between the vias and a second surface of the encapsulant opposite the first surface of the encapsulant, wherein a first area of the encapsulant at a corner of the semiconductor device includes a greater number of the vias than a second area of the encapsulant equal in size to the first area and located between a side surface of the semiconductor die and an edge of the semiconductor device;
• and
• a conductive layer formed over the second surface of the encapsulant and a first surface of the semiconductor die.

A semiconductor device, comprising:

• a semiconductor die;
• an encapsulant disposed around the semiconductor die;
• a plurality of vias formed in a first surface of the encapsulant with a first portion of the encapsulant disposed between the vias and a second surface of the encapsulant opposite the first surface of the encapsulant;
• and
• a repair material disposed in the vias and physically contacting the encapsulant along a sidewall of the vias.