Integrated circuit packaging system with magnetic film and method of manufacture thereof

A method of manufacture of an integrated circuit packaging system comprising:

• connecting a first integrated circuit device having radio frequency circuitry therein and a package substrate;
• attaching a support bump to the package substrate;
• providing a second integrated circuit device, larger than the first integrated circuit device, includes:
• providing an integrated circuit die connected to a carrier, and encapsulating with an inner encapsulation the integrated circuit die;
• applying a magnetic film on the inner encapsulation of the second integrated circuit device;
• mounting the second integrated circuit device over the first integrated circuit device with the magnetic film on the first integrated circuit device and the support bump, a bottom surface of the magnetic film spaced away from the package substrate, the support bump penetrating the magnetic film to contact the inner encapsulation of the second integrated circuit device;
• and
• forming a package encapsulation on the first integrated circuit device, the magnetic film, and the second integrated circuit device including forming the package encapsulation to fill a space between the bottom surface of the magnetic film and the package substrate.

An integrated circuit packaging system comprising:

• a package substrate;
• a first integrated circuit device connected to the package substrate;
• a support bump on the package substrate;
• a magnetic film on the first integrated circuit device and the support bump, a bottom surface of the magnetic film spaced away from the package substrate;
• a second integrated circuit device, larger than the first integrated circuit device, having an inner encapsulation on the magnetic film and the support bump penetrating the magnetic film to contact the inner encapsulation of the second integrated circuit device;
• and
• a package encapsulation on the support bump, the first integrated circuit device, the magnetic film, and the second integrated circuit device including the package encapsulation filling a space between the bottom surface of the magnetic film and the package substrate.