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US 9,318,402 B2Granted
Resin composition, prepreg and resin sheet and metal foil-clad laminate
AssigneeMitsubishi Gas Chemical Company, Inc.
InventorsMichio Yaginuma, Shoichi Ito, Yoshitaka Ueno
Life of this patent
Estimating the term…
Abstract
A resin composition is provided which can be suitably used in a printed circuit board having excellent electrical properties, heat resistance and peel strength, with flame retardancy maintained, a prepreg and resin sheet which use the same, and a metal foil-clad laminate which uses the prepreg. A resin composition including a polyphenylene ether (A), a specific phosphorus-containing cyanate ester compound (B), a non-halogenated epoxy resin (C), a cyanate ester compound (D) and a filler (E) is used.
Claims17
A resin composition comprising:
- a polyphenylene ether (A);
- a phosphorous-containing cyanate ester compound (B) represented by general formula (1):
- wherein X1 to X8 represent a hydrogen atom, an alkyl group, a cycloalkyl group, an aryl group, or an aralkyl group, which may be the same or different from each other, and
- Z represents a group represented by general formula (2):
- wherein X9 represents a hydrogen atom, an alkyl group, a cycloalkyl group, an aryl group, or an aralkyl group, which may be the same or different from each other, and a represents an integer of 1 to 4, b represents an integer of 0 to 4, and m represents an integer of 1 to 4, or
- a group represented by general formula (3):
- wherein c represents an integer of 0 to 4, and n represents an integer of 1 to 3;
- a non-halogenated epoxy resin (C);
- a cyanate ester compound (D) other than the compound represented by the formula (1);
- and
- a filler (E),
- wherein a content of the filler (E) is 10 to 200 parts by mass with respect to 100 parts by mass of a total of the (A) to (D) components, and
- wherein a content of the polyphenylene ether (A) is 50 to 90 parts by mass with respect to 100 parts by mass of a total of the (A) to (D) components.
10 more elements
Dependencies are inferred from the claim text.