Wafer-scale package including power source

A device comprising:

• a first substrate that includes at least one of a first semiconductor material and a first insulating material, the first substrate including a plurality of bonding pads;
• a second substrate that includes at least one of a second semiconductor material and a second insulating material, the second substrate bonded to the first substrate such that the first and second substrates define an enclosed cavity between the first and second substrates;
• and
• a battery housed in the enclosed cavity, the battery including conductive contacts on a bottom surface of the battery, wherein the conductive contacts are connected to two or more of the plurality of bonding pads such that the bottom surface of the battery faces the surface of the first substrate that includes the bonding pads.

A device comprising:

• a first substrate that includes at least one of a first semiconductor material and a first insulating material, the first substrate including a plurality of bonding pads;
• a second substrate that includes at least one of a second semiconductor material and a second insulating material, wherein the second substrate defines a recessed region;
• and
• a battery that is fabricated in the recessed region defined by the second substrate, the battery including conductive contacts fabricated on a surface of the battery, wherein the second substrate is bonded to the first substrate such that the first and second substrates enclose the battery, and wherein the conductive contacts are connected to two or more of the plurality of bonding pads such that the surface of the battery including the conductive contacts faces the surface of the first substrate that includes the bonding pads.