Semiconductor wafers employing a fixed-coordinate metrology scheme and methods for fabricating integrated circuits using the same

A method for fabricating an integrated circuit comprising:

• preparing a fixed-coordinate metrology scheme in accordance with a tape-out form and in integrated circuit layout design received by an integrated circuit manufacturer, wherein the fixed coordinate metrology scheme comprises:
• an external scribe region in the form of a first rectangular ring, the first rectangular ring defining a first interior space inward from the external scribe region, wherein the external scribe region comprises a plurality of overlay markings and/or critical dimension (CD) markings, and wherein the external scribe region comprises, as the first rectangular ring, two horizontal scribe marking areas defining upper and lower portions of the external scribe region and two MVS target areas disposed along opposite side regions of the external scribe region, each MVS target area being separated from the two horizontal scribe marking areas by two vertical scribe marking areas;
• an interior scribe region in the form of a second rectangular ring, disposed within the first interior space and immediately adjacent to the external scribe region at all points along its exterior perimeter, the second rectangular ring defining a second interior space inward from the interior scribe region, the second interior space being wholly within the first interior space;
• a technology-specific tile region disposed within the second interior space and immediately adjacent to the interior scribe region;
• an electrical testable scribe line measurement (ETSLM) region disposed within the second interior space and immediately adjacent to both the technology-specific tile region and the interior scribe region;
• and
• a free floorplan area disposed within the second interior space and immediately adjacent to both the ETSLM region and the interior scribe region;
• providing metrology markings to a semiconductor wafer in accordance with the fixed-coordinate metrology scheme and the tape-out form;
• forming ETSLM structures within the ETSLM region and forming technology-specific tile-containing chips within the technology-specific tile region;
• and
• fabricating a plurality of integrated circuit chips within the free floorplan area in accordance with the integrated circuit layout design.