Systems and methods for preparation of samples for sub-surface defect review
AssigneeKLA-Tencor Corporation
InventorsCecelia Campochiaro, Hong Xiao, Michael Van Riet, Benjamin James Thomas Clarke, Harsh Sinha
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AssigneeKLA-Tencor Corporation
InventorsCecelia Campochiaro, Hong Xiao, Michael Van Riet, Benjamin James Thomas Clarke, Harsh Sinha
Estimating the term…
One embodiment relates to a method of preparation of a sample of a substrate for sub-surface review using a scanning electron microscope apparatus. A defect at a location indicated in a first results file is re-detected, and the location of the defect is marked with at least one discrete marking point having predetermined positioning relative to the location of the defect. The location of the defect may be determined relative to the design for the device, and a cut location and a cut angle may be determined in at least a partly-automated manner using that information. Another embodiment relates to a system for preparing a sample for sub-surface review. Another embodiment relates to a method for marking a defect for review on a target substrate. Other embodiments, aspects and feature are also disclosed.
A method of preparation of a sample of a substrate for sub-surface review using a scanning electron microscope apparatus, the method comprising:
A system for preparing a sample for sub-surface review, the system comprising:
A method for marking a defect for review on a target substrate, the method comprising:
Dependencies are inferred from the claim text.