Apparatus and methods for through substrate via test
AssigneeMicron Technology, Inc.
InventorsEbrahim H Hargan, Layne Bunker, Dragos Dimitriu, Gregory A. King
Life of this patent
Estimating the term…
Abstract
A stack of vertically-connected, horizontally-oriented integrated circuits (ICs) may have electrical connections from the front side of one IC to the back side of another IC. Electrical signals may be transferred from the back side of one IC to the front side of the same IC by means of through substrate vias (TSVs), which may include through silicon vias. Electronic apparatus, systems, and methods may operate to test and/or replace defective TSVs. Additional apparatus, systems and methods are disclosed.
Claims18
A method of comparing electrical resistances, comprising:
- connecting an output of an adjustable reference to a first input terminal of a sense amplifier circuit;
- adjusting a level of the output by a plurality of steps of a selected size;
- connecting a second input terminal of the sense amplifier circuit to at least one of a plurality of electrical paths each comprising a series connected plurality of vias;
- applying a first current having a selected value to at least one of the plurality of electrical paths;
- determining when the output equals a voltage on the second input terminal of the sense amplifier;
- recording the level for each of the plurality of electrical paths;
- and
- determining a quality factor proportional to the voltage on the second input terminal for each of the plurality of electrical paths.
A method, comprising:
- connecting a plurality of integrated circuits to form a plurality of series connected electrical through substrate via stacks;
- connecting a first reference to a power supply through a first resistor having a selected resistance value;
- connecting a first end of a series connected electrical through substrate via stack to the first reference by a second selected resistance coupled to a first transistor having a transistor resistance value;
- connecting a second end of the series connected electrical through substrate via stack to a second reference;
- connecting a first end of each one of the series connected electrical through substrate via stacks through a second transistor to the first reference;
- connecting a second end of each one of the series connected electrical through substrate via stacks to be measured through a first input of a sense amplifier;
- connecting a second input of each sense amplifier to the second reference;
- and
- determining a resistance of each one of the plurality of series connected electrical through silicon via stacks by measuring an output value of each sense amplifier.
Dependencies are inferred from the claim text.