Wafer alignment methods in die sawing process
AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorsYu-Hsiang Hu, Ming-Da Cheng, Chung-Shi Liu
Life of this patent
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Abstract
A method includes forming a molding compound molding a lower portion of an electrical connector of a wafer therein. The molding compound is at a front surface of the wafer. The molding compound covers a center region of the wafer, and leaves an edge ring of the wafer not covered. An opening is formed to extend from the front surface of the wafer into the wafer, wherein the opening is in the edge ring of the wafer. A backside grinding is performed on the wafer until the opening is revealed through a back surface of the wafer. The method further includes determining a position of a scribe line of the wafer using the opening as an alignment mark, and sawing the wafer from a backside of the wafer by sawing through the scribe line.
Claims20
A method comprising:
- forming an opening extending from a front surface of a wafer into the wafer, wherein the opening has lengths smaller than lengths and width of chips in the wafer;
- performing a backside grinding on the wafer until the opening is revealed through a back surface of the wafer;
- and
- sawing the wafer from a back side of the wafer, wherein during the sawing the wafer, a semiconductor material of a semiconductor substrate in the wafer is sawed through, and wherein the opening exposed through the back surface of the wafer is used as an alignment mark for the sawing.
A method comprising:
- forming a molding compound molding a lower portion of an electrical connector of a wafer therein, wherein the molding compound is at a front surface of the wafer, and wherein the molding compound covers a center region of the wafer, and leaves an edge ring of the wafer not covered;
- forming an opening extending from the front surface of the wafer into the wafer, wherein the opening is in the edge ring of the wafer;
- and
- performing a backside grinding on the wafer until the opening is revealed through a back surface of the wafer.
A method comprising:
- forming a molding compound molding a lower portion of a solder ball of a wafer, wherein the molding compound is at a front surface of the wafer, and covers a center region of the wafer, wherein an edge ring of the wafer is not covered by the molding compound;
- forming a first opening and a second opening extending from a front surface of the wafer to an intermediate level of a semiconductor substrate of the wafer, wherein the first opening and the second opening are in scribe lines of the wafer, and wherein the first opening and the second opening are formed in the edge ring;
- adhering the front surface of the wafer to a carrier;
- performing a backside grinding on a back side of the semiconductor substrate, wherein the first and the second openings are revealed through the semiconductor substrate;
- determining scribe lines of the wafer using the first and the second openings as alignment marks;
- and
- sawing the wafer by sawing through the scribe lines.
Dependencies are inferred from the claim text.