Slot designs in wide metal lines

A method of fabricating an interconnection comprising:

• providing a substrate prepared with a dielectric layer;
• and
• forming a continuous conductive line in the dielectric layer comprising
• patterning the dielectric layer to form a trench in the dielectric layer corresponding to the continuous conductive line, wherein the patterning forms within the trench with at least one dielectric structure positioned in a portion of the trench, and
• filling the trench with a conductive material that surrounds the at least one dielectric structure to form the continuous conductive line having the at least one dielectric structure therein, wherein the dielectric structure creates a partial discontinuity within the continuous conductive line, the dielectric structure is disposed within a distance from a via plug in a via level which is in communication with the continuous conductive line.

A method of fabricating an integrated circuit comprising:

• providing a substrate prepared with a dielectric layer;
• patterning the dielectric layer to form a trench in the dielectric layer corresponding to a continuous conductive line, wherein the trench includes a dielectric structure within the trench;
• and
• filling the trench with conductive material that surrounds the dielectric structure to form the continuous conductive line, wherein the continuous conductive line contains the dielectric structure therein, the dielectric structure creates a partial discontinuity within the continuous conductive line, wherein the dielectric structure is positioned in a portion of the trench that is proximal to the conductive line which has a via plug in communication therewith.