Method and apparatus for protection against process-induced charging

A method for forming a semiconductor device, comprising:

• providing a substrate;
• forming a charge passage device coupled to the substrate;
• forming one or more thin film devices coupled to the charge passage device, wherein at least one of the one or more thin film devices includes at least one high impedance thin film device;
• and
• forming an at least semiconductive layer connected to the one or more thin film devices, wherein in-process charges generated therein, during and since formation of the at least semiconductive layer is dissipated to the substrate through a connection provided by the one or more thin film devices and the charge passage device.