Die bonder and a method of cleaning a bond collet
AssigneeAsm Technology Singapore Pte Ltd
InventorsMei Po Leung, Wing Yin Lee, Chi Ming Chong
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Abstract
A die bonder comprises a movable bond collet for holding an electronic device, and a platform which comprises a cleaning surface for cleaning the bond collet when the bond collet contacts the cleaning surface. The die bonder also comprises a cleaning agent supply, wherein the cleaning agent supply is operative to provide a cleaning agent to the cleaning surface to facilitate the cleaning of the bond collet.
Claims16
A die bonder, comprising:
- a movable bond collet for holding an electronic device;
- a platform comprising a cleaning surface for cleaning the bond collet when the bond collet contacts the cleaning surface, wherein the platform is movable between a first position and a second position;
- a biasing mechanism configured to bias the platform towards the first position;
- and
- a cleaning agent supply;
- wherein the cleaning agent supply is operative to provide a cleaning agent to the cleaning surface to facilitate the cleaning of the bond collet.
A die bonder, comprising:
- a movable bond collet for holding an electronic device;
- a platform comprising a cleaning surface for cleaning the bond collet when the bond collet contacts the cleaning surface;
- a resilient material on which the cleaning surface is arranged, so as to reduce impact on the bond collet when the bond collet contacts the cleaning surface;
- and
- a cleaning agent supply;
- wherein the cleaning agent supply is operative to provide a cleaning agent to the cleaning surface to facilitate the cleaning of the bond collet.
A method of cleaning a bond collet of a die bonder which is configured for holding an electronic device, the method comprising the steps of:
- providing a cleaning agent to a cleaning surface comprised in a platform from a cleaning agent supply;
- contacting the bond collet on the cleaning surface;
- pushing the platform with the bond collet from a first position to a second position when contacting the bond collet on the cleaning surface;
- and
- cleaning the bond collet on the cleaning surface.
Dependencies are inferred from the claim text.