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US 9,318,358 B2Granted
Etching device and a method for etching a material of a workpiece
AssigneeInfineon Technologies AG
InventorsThomas Fischer, Raimund Foerg, Sebastian Bernrieder, Michael Larisch
Life of this patent
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Abstract
An etching device is provided, the etching device including a process chamber including an etchant, a structure configured to provide a laminar flow of the etchant, and a workpiece handler configured to move a workpiece through the laminar flow of the etchant along a predefined track.
Claims21
An etching device, comprising:
- a process chamber comprising an etchant;
- a structure configured to provide a laminar flow of the etchant;
- and
- a workpiece handler configured to hold and move a workpiece through the laminar flow of the etchant along a predefined track, wherein the workpiece handler is configured to hold the workpiece so that a side of the workpiece to be etched is substantially perpendicular to the laminar flow of the etchant, and so that the workpiece is fully immersed in the etchant.
1 more element
Dependencies are inferred from the claim text.