Method for producing a multiplicity of optoelectronic semiconductor components

A method for producing a plurality of optoelectronic semiconductor devices, the method comprising:

• applying a plurality of arrangements of electrically conductive first and second contact elements on an auxiliary carrier;
• applying an optoelectronic semiconductor chip on the second contact element of each arrangement;
• electrically conductively connecting the optoelectronic semiconductor chip to the first contact element for each arrangement;
• encapsulating the first contact elements and the second contact elements with an encapsulation material to form an encapsulation body;
• and
• singulating the encapsulation body into the plurality of optoelectronic semiconductor devices,
• wherein the encapsulation material finishes flush with an underside, facing the auxiliary carrier, of each first contact element,
• wherein the encapsulation material finishes flush with an underside, facing the auxiliary carrier, of each second contact element,
• wherein a plurality of separating frames are attached to the auxiliary carrier before encapsulating the first contact elements and the second contact elements,
• wherein each separating frame encloses at least one arrangement of the first contact elements and the second contact elements at least in certain places laterally,
• wherein side faces of the singulated optoelectronic semiconductor devices comprise in certain places parts of the separating frames,
• wherein the encapsulation material or a converter material cover(s) the separating frames on upper sides, facing away from the auxiliary carrier, and
• wherein the first contact elements and the second contact elements are completely enclosed by the encapsulation material on an underside of the singulated optoelectronic semiconductor devices.