Method of manufacturing connection structure

A method of manufacturing a connection structure, the connection structure including a wiring substrate, a first electronic component flip-chip mounted on a front surface thereof, and a second electronic component flip-chip mounted on a rear surface, the method comprising the following steps (a) to (d):

• Step (a)
• a step of temporarily mounting the first electronic component on the front surface of the wiring substrate with a first adhesive film disposed therebetween;
• Step (b)
• a step of temporarily mounting the second electronic component on the rear surface of the wiring substrate with a second adhesive film disposed therebetween, the second adhesive film having a curing temperature lower than a curing temperature of the first adhesive film;
• Step (c)
• a step of placing, on a pressure bonding receiving base, the wiring substrate on which the first electronic component and the second electronic component are temporarily mounted;
• and
• Step (d)
• a step of heating the first electronic component while pressing the first electronic component against the wiring substrate with a heating and pressing tool from the side of the first electronic component, thereby mounting simultaneously the first electronic component and the second electronic component onto the respective front and rear surfaces of the wiring substrate,
• wherein, when the first electronic component is heated and pressed with the heating and pressing tool in the step (d), the first adhesive film reaches, by being heated, a temperature that is higher than a temperature that the second adhesive film reaches by being heated.