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US 9,318,352 B2Granted
Power module package and method for manufacturing the same
AssigneeSamsung Electro-Mechanics Co., Ltd.
InventorsKwang Soo Kim, Young Ki Lee, Seog Moon Choi, Jin Suk Son
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Abstract
Disclosed herein are a power module package and a method for manufacturing the same. The power module package includes first and second lead frames disposed to face each other; ceramic coating layers formed on a portion of a first surface of both or one of both of the first and second lead frames; and semiconductor devices mounted on second surfaces of the first and second lead frames.
Claims9
A method for manufacturing a power module package, comprising:
- preparing first and second lead frames disposed to face each other;
- forming ceramic coating layers on a portion of a first surface of both the first and second lead frames by firing;
- and
- mounting semiconductor devices on second surfaces of the first and second lead frames,
- wherein the ceramic coating layers are directly formed on the first surface of the first and second lead frames.
2 more elements
Dependencies are inferred from the claim text.