Wiring substrate
AssigneeShinko Electric Industries Co., Ltd.
InventorMasahiro Sunohara
Life of this patent
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Abstract
A wiring substrate includes a substrate body, a through hole extending through the substrate body from an upper surface to a lower surface of the substrate body, and a through electrode formed in the through hole. The through electrode includes a conductive layer that forms a cavity in the through hole, and a resin layer that fills the cavity. The conductive layer includes first to third metal layers. The first metal layer is formed on an upper wall surface of the through hole. The second metal layer covers at least a portion of the first metal layer and an upper opening of the through hole. The third metal layer is formed on a lower wall surface of the through hole and connected to at least the first metal layer or the second metal layer.
Claims7
A wiring substrate comprising:
- a substrate body;
- a through hole extending through the substrate body from an upper surface of the substrate body to a lower surface of the substrate body, wherein the through hole includes an upper wall surface, which continues with the upper surface, and a lower wall surface, which continues with the lower surface;
- and
- a through electrode formed in the through hole;
- wherein the through electrode includes
- a conductive layer that forms a cavity in the through hole, and
- a resin layer that fills the cavity formed by the conductive layer,
- wherein the conductive layer includes
- a first metal layer formed on the upper wall surface of the through hole,
- a second metal layer that covers at least a portion of the first metal layer and closes an upper opening of the through hole, and
- a third metal layer formed on the lower wall surface of the through hole and connected to at least one of the first metal layer and the second metal layer.
Dependencies are inferred from the claim text.