Electrical contact apparatus, assemblies, and methods
AssigneeSiemens Industry, Inc.
InventorsHector Manuel Malacara-Carrillo, Thomas William Holland, Oscar Rodrigo Ollervides Madrigal
Life of this patent
Estimating the term…
Abstract
An electrical contact is disclosed. The electrical contact includes a first element of a first material having one or more aperture, and a second element of a second material, the second element being positioned in at least one aperture of the one or more aperture of the first element, wherein the second material is different from the first material. Electrical contact devices, assemblies, and methods are provided, as are other aspects.
Claims20
An electrical contact assembly, comprising:
- an outer element of a first material composition having one or more apertures, wherein the first material composition includes an electrically conductive metal having a first range of % of the electrically conductive metal and a first material, the first material composition having a mechanical wear property and an electrical wear property;
- an inner element of a second material composition contacted through a length of at least one aperture of the one or more aperture, wherein the second material composition includes the electrically conductive metal having a second range of % of the electrically conductive metal and a second material, the second material composition having an electrical conductivity property;
- and
- a solder layer configured to solder both the inner element and the outer element directly to at least one conductor such that both the inner element and the outer element are soldered onto the at least one conductor by the solder layer,
- wherein the outer element is arranged to surround the inner element such that the outer element provides a structure for supporting the inner element when the inner element gets soft when hot during operation,
- wherein the second range of % of the electrically conductive metal is different from the first range of % of the electrically conductive metal,
- wherein the second material is different from the first material.
An electrical contact assembly of a circuit interconnect device, comprising:
- a first element of a first material, the first element having one or more aperture;
- a second element of a second material, the second element positioned in at least one aperture of the one or more aperture,
- wherein the second material is different from the first material;
- and
- a solder layer configured to solder both the first element and the second element directly to at least one conductor such that both the first element and the second element are soldered onto the at least one conductor by the solder layer.
A method for preparation of an electrical contact, comprising:
- providing a first element of a first material having a composition of silver having a range of about 40% to about 60%, the first element having one or more aperture;
- providing a second element of a second material having a composition of silver having a range of about 70% or more;
- inserting the second element into at least one aperture of the one or more aperture of the first element;
- and
- soldering both the first element and the second element directly to at least one conductor by a solder layer such that both the first element and the second element are soldered onto the at least one conductor by the solder layer.
Dependencies are inferred from the claim text.