Multilayer ceramic capacitor provided with external electrodes partially covered by solder non-adhesion film

A multilayer ceramic capacitor comprising a dielectric chip made of dielectric ceramics and having a roughly rectangular shape, as well as external electrodes respectively positioned on opposing ends thereof, where ends of parts of multiple internal electrode layers built into the dielectric chip in a manner not contacting each other are connected to one external electrode, while ends of the other parts are connected to the other external electrode, wherein:

• each of the external electrodes has an end face of roughly rectangular shape covering an end face of the dielectric chip, a side face of roughly quadrangular cylinder shape covering a part of four side faces of the dielectric chip, and a curved face of roughly arc cross-section present between the end face and side face;
• and
• each of the external electrodes has a solder non-adhesion film made of material to which solder does not adhere, said solder non-adhesion film continuously and exclusively covering an entire surface of the end face and a part or an entire surface of the curved face without covering the side face wherein a distance between an edge of the solder non-adhesion film on one end of the capacitor and an edge of the solder non-adhesion film on the other end of the capacitor, which corresponds to an outer edge distance of solder to be attached to each external electrode, is shorter than a length of the dielectric chip.