Method of manufacturing an electronic component

A method of manufacturing an electronic component, comprising:

• providing a wire having first and second ends, a core having first and second ends with a portion extending therebetween about which the wire is wound, and at least one terminal for connecting to the wire;
• winding the wire onto the portion extending between the first and second ends of the core and connecting the wire to the at least one terminal;
• heating a powdered mixture of magnetic and non-magnetic materials to create a liquefied mixture;
• dispersing the liquefied mixture over at least a portion of the wound wire in a mold using an injection molding or compression molding process without exposing the wire to the damaging forces of a dry press process;
• hardening the heated mixture over the at least a portion of the wire to form an outer body of the electronic component in the mold;
• and removing the hardened electronic component from the mold without requiring further baking of the electronic component to provide a finished electronic component.

A method of manufacturing an electronic component, comprising:

• providing a wire having first and second ends;
• winding the wire into a coil having a central opening orientated about a generally vertical axis with the first and second wire ends connected to or forming terminals for mounting the component to a circuit;
• heating a mixture of magnetic and non-magnetic material to a liquid and dispersing the liquefied mixture over the coil, and hardening the mixture without exposing the coil to the damaging forces of a dry press process to form an electronic component with a generally planar top surface with which the component can be picked and placed on a circuit using conventional pick-and-place equipment,
• wherein the mixture comprises at least about 80% iron.